Sonion Launches World's Smallest Microphone
It's silicon, digital and with a tiny 3 cubic mm size- the new DigiSiMic fits perfectly into tomorrow's mobile phones, PDAs, and headsets.
Roskilde, Denmark (PRWEB via PR Web
Direct) September 16, 2005 -- Sonion is proud to announce the launch of the
DigiSiMic microphone, the world's smallest digital, silicon microphone. Sonion
products, such as the DigiSiMic help mobile phone manufacturers design smaller,
lighter products with cost in mind.
"After more than a decade of
research, the DigiSiMic is a development breakthrough for the industry. It is a
minute, feather light but still a very robust microphone that has stable high
quality acoustic performance," said Jacob Philipsen, president of Sonion
MEMS.
With a footprint of only 2.6 x 1.6 mm2 the DigiSiMic is ideal for
applications where minimum microphone size is key.
As analogue electric
condenser microphones (ECM) are the standard in today's mobile terminals with
analogue silicon microphones emerging, the DigiSiMic represents a technological
leap towards the fully digitalized mobile phone architectures of
"tomorrow."
"The launch of the DigiSiMic allows Sonion to strengthen our
position as a one-stop shop for mobile phone acoustical equipment as the company
can now add advanced microphones to its range of speciality miniature audio
receivers and loudspeaker," said Peter U. Scheel, CEO of Sonion.
The
DigiSiMic, which is SMT compliant, integrates a microphone chip and an ASIC
assembled onto a carrier chip to form a single pinhead-sized "all-silicon"
component.
The microphone chip holds the acoustic sensor structure and
the ASIC contains a bias-circuit, a low-noise pre-amplifier and a
sigma-delta-based A/D converter. The output is a single-bit digital output
stream that can be connected to downstream digital electronics for a high degree
of flexibility and freedom. Acoustic performance of the DigiSiMic is equal to or
better than today's conventional microphones.
An important benefit of
the DigiSiMic is its reduced susceptibility to temperature and humidity, as well
as its high immunity to electromagnetic interference (EMI). The closely
integrated microphone and ASIC in a sealed, all-silicon chip scale package,
dramatically reduces parasitic electrical elements, while the digital output
eliminates EM interference for transmission over long distances. This allows
product designers flexibility in the system design in e.g. a mobile phone,
including the possibility to implement arrays of microphones for directionality
or noise cancellation.
The DigiSiMic has been selected by one of the
major mobile phone manufactures and is currently undergoing production ramp-up
in Sonion's clean-room based production facility.
Key features and
benefits of the DigiSiMic:
* Size, all silicon package and
surface mountability – ease manufacturing costs and increase efficiency.
* Integrated Solution – Integrated microphone, analogue
pre-amplifier and sigma-delta modulator reduce component count and board space,
as well as RF/EM interference.
* High Suppression of RF
and EM Interference – Digital output eliminates EM interference over long
transmission distances, enabling microphone arrays that increase performance.
* Digitalization – Enables high performance microphone
array applications.
* Left/Right feature enabling stereo
application over a single data wire.
In addition to the DigiSiMic,
Sonion is also launching the SiMic, the industry's smallest analogue microphone
this week. The product brings an unparalleled level of performance and fidelity,
including a typical signal-to-noise ratio of 61 dB in a previously unachievable
small package size with a footprint of only 2.4 x 1.6 mm2.
For more
information contact:
Sharmi Albrechtsen
Head of Corporate Communication,
Sonion A/S
+45 7025 6510
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Peter U. Scheel
President & CEO, Sonion
A/S
Mobile phone: +45 4025 0974
Jørn Bjerregaard-Nielsen
Executive Vice President, Sonion A/S
Mobile
phone: +45 2049 0884
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Source : http://www.prweb.com/releases/2005/9/prweb285800.htm