Speedline Technologies to Showcase Leading Industry Solutions at Nepcon Thailand 2005, with Niche Tech (2004) Co. Ltd.
Speedline Technologies, the global leader for single-source process knowledge, solutions, and service to the PCB assembly and semiconductor packaging industries, will showcase the industry’s leading solutions and technologies at Nepcon Thailand 2005, Booth No. 4D29, Bangkok, 16-19 June 2005.
FRANKLIN, MA (PRWEB) May 23, 2005 -- Speedline Technologies, the global
leader for single-source process knowledge, solutions, and service to the PCB
assembly and semiconductor packaging industries, will showcase the industry’s
leading solutions and technologies at Nepcon Thailand 2005, Bangkok, 16-19 June
2005.
Speedline Technologies will host ongoing exhibits and
demonstrations of the solutions in Booth No. 4D29 throughout the Exhibition,
including:
· The MPM AccuFlex stencil printer, ideally suited for
moderate volume high-mix printing at a cost-effective price, combines accuracy
and unparalleled flexibility in a compact footprint. Providing only what is
needed for efficient and precise printing, the AccuFlex offers electronics
manufacturer a full range of options for future expansion. Designed for
production of about 8,000 boards per week with two or more product changeovers
per shift, the system easily handles boards from 3" x 2" to 23" x 20" and is
capable of printing 12-mil pitch devices with consistent accuracy.
· The
accurate, flexible, and configurable Camalot XyflexPro dispensing system
features a calibration-free linear gantry drive system, small footprint, and
ability to meet any application need through easy-to-add options. Whether
dispensing micro dots of silver epoxy, solder paste for high-frequency devices
and wafer-level packages, adhesive for 0201 components, or underfill for flip
chip packages or flip chip on board, the XyflexPro system provides the required
accuracy to maintain ultimate process control.
· The MPM Gel-Flex™
Tooling System is an innovative and cost-effective answer to the challenge of
supporting the circuit board during the stencil printing process. Consisting of
non-conductive polyurethane elastomer gel enclosed within a durable membrane
shell and mounted to a magnetic base, Gel-Flex tooling is a true conformal
board-support system. The compressible gel material provides gentle compliance
to delicate bottom-side components and leads while providing firm support for
the entire board surface. This tooling system is available for AccuFlex, AP
Excel, Ultraprint 2000, and UltraFlex BBP printers. It is also available as an
upgrade for those printers as well as the AP Series, Ultraprint 400 and
Ultraprint 500 platforms.
For more information, contact Mr. Kwa Siong
Soon, Speedline’s Business Manager, or Mr. Phermphoon Ekpho, Niche Tech (2004)’s
MD.
Speedline Technologies: The Process Knowledge Leaders
Speedline
Technologies is the global leader for single-source process knowledge,
solutions, and service to the PCB assembly and semiconductor packaging
industries. Based in Franklin, Massachusetts, USA, the company sells five,
best-in-class brands – Accel® microelectronics cleaning, Camalot® dispensing
systems, Electrovert® wave soldering, reflow soldering, and cleaning equipment,
MPM® stencil and screen printing systems, and Protect® global services, support,
and training solutions. For more information, visit Speedline Technologies at http://www.speedlinetech.com or contact:
· In Asia:
Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre,
Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: e-mail protected
from spam bots;
· In the USA: Speedline Technologies, 16 Forge Park,
Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: e-mail
protected from spam bots;
· In Europe: Speedline Technologies GmbH, Im
Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax:
+49(0)6103/832-299, E-mail: e-mail protected from spam bots.
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Source: http://www.prweb.com/releases/2005/5/prweb243442.htm