Breakthrough Ultra Thin Wafer Support Solution Ready for the Semiconductor Market
AMS brings innovative technology to leading chip manufacturers.
Portland, OR (PRWeb) July 8, 2005--Advance Material Sciences, Inc. (AMS) will
introduce a major advance in wafer thinning technology at SEMICON West in San
Francisco, CA July 12-14. Even before its official launch, the AMS ultra thin
wafer support solution has begun to attract considerable attention from leading
players in the international semiconductor device industry. Early adopters are
currently being trained and qualified in the new process.
The core of the
breakthrough solution is AMS's patent pending Protective Disc System (PDS™),
which enables the high-volume, cost-effective production of ultra-thin silicon
and compound semiconductor wafers. The PDS™ process, an innovation of AMS's
world-class team of engineers, permits the high-volume manufacture (HVM) of
ultra-thin wafers below 75 microns, while improving yields and reducing costs.
This new wafer substrate and process virtually eliminates the breakage that
often results from the use of conventional handling tools by increasing the
rigidity of ultra-thin wafers beyond that of current taping technology. The
innovation makes possible ultra-thin wafers that are surprisingly strong and
durable.
The PDS™ solution also results in dramatically lower costs to
manufacturers through increased yields for both wafers and devices. The PDS™
solution integrates seamlessly into the semiconductor back-end process and is
fully compatible with existing grinding and stress relief
technology
Michael Lubitz, Chairman of AMS, said, “We are pleased to be
able to offer this exciting new technology for wafer manufacturing and
processing to the industry. Our customers will now have access to technology
that enables them to become leaders in high-volume wafer thinning. We currently
have several customers who are qualifying the PDS™ solution for ultra-thin
silicon and compound wafers.”
AMS will be exhibiting with its OEM
partner, PCT Systems, in the South Hall, booth 538.
About Advanced
Material Sciences
AMS has developed a cost-effective wafer support
substrate solution enabling high volume wafer thinning below 75 microns. The
PDS™ imparts sufficient strength and rigidity to the wafer, enabling the wafer
to be safely processed and handled thus, increasing wafer and device yields
while reducing total cost of ownership. The PDS™ solution easily integrates into
the semiconductor back-end process and is compatible with existing grinding and
stress relief technologies. AMS leads the industry in the development of
advanced, high-volume manufacturing, wafer-thinning process technology. For more
information, please visit the Company’s website at www.advmatsci.com. For
investor-specific information, please visit www.intellectcap.com
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Source : http://www.prweb.com/releases/2005/7/prweb259561.htm