Speedline Technologies Schedules Free Monthly Technical Webcast Seminars
Speedline Technologies, Inc. has scheduled a series of free monthly technical webcast seminars exploring the major challenges facing engineers in the semiconductor manufacturing process. Each of the seminars, to be hosted by industry experts, will include the sharing of “knowledge in process” expertise, how-to insights and a Q & A session.
Franklin, MA (PRWEB) August 25, 2004 –- Speedline Technologies Inc. has
scheduled a series of free monthly technical webcast seminars exploring the
major challenges facing engineers in the semiconductor manufacturing process.
Each of the seminars, to be hosted by industry experts, will include the sharing
of “knowledge in process” expertise, how-to insights and a Q & A session.
The schedule is:
“Lead-Free Wave Soldering”
* Thursday, September 23,
2004
* Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
* Is your wave
soldering process ready for the transition to lead-free materials? There are
many misconceptions about equipment requirements for lead-free wave soldering.
This seminar will explore what is really required for this transition. Topics
will include:
o Wave solder
equipment configurations
o
Flux chemistries and solder alloys
o Material/Equipment
interaction
o Defect
reduction
“Improving Final Product Quality”
* Thursday, October 21,
2004
* Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m., ET
* The cost of a
defect increases exponentially as it moves through the production process. A
defect that ships to a customer costs hundreds of times more than an error that
is discovered immediately after the printing process. However, even in a
well-controlled production environment, defects still occur. What can be done to
limit the number of defects and their impact on your production capabilities?
This seminar will cover the following topics:
o Cost and types of a
defect
o Impact of printing
defects on first pass yield
o Preventing defects
o
Inspection and test process planning
o 2D and 3D solder paste inspection
“Reliable
Underfill Dispensing”
* Thursday, November 18, 2004
* Live: 11 a.m. -
Noon, ET and 2 p.m. – 3 p.m., ET
* There are many applications for underfill
dispensing and all require significant knowledge about the various materials and
equipment used for the process. This chip connection process step is critical
for flip chip manufacturing and can use many types of materials. This seminar
will cover the following topics:
o Why use underfill?
o Underfill materials
o Underfill process
variables
o Improving
material flow
o Equipment
variables
o Equipment
optimization & dispensing patterns
“Fine Pitch Printing Process”
*
Thursday, December 16, 2004
* Live: 11 a.m. - Noon, ET and 2 p.m. – 3 p.m.,
ET
* As technology continues to move towards smaller components, it becomes
increasingly important to print to meet fine pitch requirements. With 0201
chips, chip scale packages and microBGAs becoming more prevalent, a process
engineer must fully understand every aspect of the fine pitch printing process.
Topics in this seminar will include:
o Squeegee selection
o Solder paste evaluation
o Lead free solder paste
printing
o Stencil design,
including pin-in-paste
o
Aperture design
o 45 degree
printing
o Board
support
o Fast cycle time
printing
o Post-print
inspection (2D and 3D)
All seminars are free. Participation is as easy as
visiting a website and dialing into a toll-free telephone number.
To
register, or for more information, visit www.speedlinetech.com/seminars on the Web or call
508-541-4749.
About Speedline Technologies
Speedline Technologies is
the global leader for single-source process knowledge, solutions, and service to
the PCB assembly and semiconductor packaging industries. Based in Franklin,
Massachusetts, USA, the company sells five, best-in-class brands – Accel®
microelectronics cleaning, Camalot® dispensing systems, Electrovert® wave
soldering, reflow soldering, and cleaning equipment, MPM® stencil and screen
printing systems and Protect® global services, support, and training solutions.
For more information, visit us at www.speedlinetech.com
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Source : http://www.prweb.com/releases/2004/8/prweb152218.htm