Speedline Technologies Showcases Leading SMT Process Solutions at ATExpo 2005
Speedline Technologies, Inc., will showcase industry leading MPM printers, an Electrovert reflow oven and wave soldering equipment at ATExpo 2005, 27-29 September, in Rosemont, IL, booth number 5710.
Franklin, MA (PRWEB) September 9, 2005 -- Speedline Technologies, Inc., will
showcase industry leading MPM printers, an Electrovert reflow oven and wave
soldering equipment at ATExpo 2005, 27-29 September, in Rosemont, IL, booth
number 5710.
Speedline’s exhibit at the show will spotlight the following
systems from the comprehensive line of assembly equipment solution the company
delivers to the electronics assembly and semiconductor packaging
industries:
Speedline’s MPM AccuFlex printing system will be part of the
live, working electronics assembly line at the center of this year’s show. The
printer is ideally suited for moderate volume, high-mix printing at a
cost-effective price. Combining accuracy and unparalleled flexibility in a
compact footprint, the printer provides only what is needed for efficient and
precise printing, while offering a comprehensive range of options for future
expansion or demanding advanced processes. The system is designed for production
of about 8,000 boards per week, with two or more product changeovers per shift.
In its booth, Speedline will spotlight its newest stencil printer, the
MPM Accela printing system. The revolutionary new design and theory of operation
in this printer have created a paradigm shift in the way electronics
manufacturers view and measure printer performance. With the Accela’s innovative
parallel processing technology the focus of measuring printer performance has
shifted from base cycle time to total throughput, the more important criteria
for manufacturers requiring high volume throughput with high yield performance.
The new system produces the most boards per hour of any industry printer –
delivering raw throughput gains of 20% to 80% over the closest competitor and
generating more quality boards per hour; therefore increasing the return on
capital investment.
The printer is also designed for ease of use, and
features a completely new, robust design and easy-to-use operator interface.
Offering superior accuracy and repeatability, this printer is well positioned
for the challenge of lead-free assembly and the increasingly complex boards used
throughout the industry.
Also on display will be Speedline’s Electrovert
OmniExcel 7, a lead-free capable, 7-zone, forced convection reflow oven
specifically designed to optimize operating efficiencies, reduce maintenance
intervals, and lower life-cycle costs.
The system features an advanced
chamber design for more balanced airflow with minimal turbulence, which improves
heat transfer and substantially reduces power and N2 consumption. Compared to
other platforms, the OmniExcel consumes up to 50% less power and up to 35% less
nitrogen. Besides multiple other options the system can be equipped with
Speedline’s proprietary self-cleaning Flux Extraction Systems? (FES), delivering
a dramatic drop in maintenance intervals from a typical weekly schedule to once
per month, which translates into more uptime for our customers. Speedline’s
newest enhancement, the OmniCheck monitoring system, delivers a cost-effective,
redundant check on process temperatures and conveyor belt, and provides both
extensive data tracking and monitoring capabilities of the process parameters.
In addition Speedline will exhibit two systems that simplify the process
and enhance the quality of the lead-free manufacturing, its Electrovert
Quick-Change Solder Module equipped with the new UltraFill Nozzle.
The
Quick-Change Solder Module’s design allows for easy changeover between tin/lead
and lead-free alloys and its cast iron solder pot and other components are
resistant to the corrosive nature of lead-free solders and capable of
withstanding temperatures of 315ºC (600ºF).
Speedline’s new UltraFill
Lead-Free Nozzles feature an innovative technology and design to overcome a
variety of process challenges inherent in lead-free wave soldering.
The
nozzles are 40% wider than traditional tin/lead nozzles to increase contact
length and dwell time. The nozzles are also placed closer together to reduce the
temperature drop between the nozzles – so that less heat is needed to reflow
solder joints in the second wave. As a result, UltraFill nozzles deliver better
hole fill without requiring a slowing of the conveyor, while reducing bridge
defects and dross production.
With the optional nitrogen shroud either
air or nitrogen operation can be chosen; without the need to change nozzles.
Recent applications have shown UltraFill nozzles enhance both product quality
and process.
All of the featured solutions are immediately available from
Speedline distributors and representatives. For more information, visit
Speedline Technologies during ATExpo 2005 in booth number 5710, contact your
Speedline distributor or representative, or reach Speedline Technologies at
1-508-520-0083 or http://www.speedlinetech.com.
ATExpo 2005 will be held
September 27-29, 2005, at the Donald E. Stephens Convention Center, Rosemont,
IL, USA.
About Speedline Technologies
Speedline Technologies is the
global leader in process knowledge and expertise for the PCB assembly and
semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company
markets five best-in-class brands — Accel microelectronics cleaning equipment;
Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and
cleaning equipment; MPM stencil and screen printing systems; and Protect global
services, support, and training solutions. Speedline Technologies is Frost &
Sullivan’s “2005 Surface Mount Technology Company of the Year.” For more
information, visit: http://www.speedlinetech.com or contact Speedline at:
•
USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel:
1-508-520-0083, Fax: 1-508-520-2288, E-mail: e-mail protected from spam bots;
• Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich,
Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: e-mail
protected from spam bots;
• Asia: Speedline Technologies Asia Pte Ltd, 150
Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax:
65-6289-9411, E-mail: e-mail protected from spam bots.
Note to Editors:
Download high resolution photo for publication from: http://www.tizinc.com/speedline/images/
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Source : http://www.prweb.com/releases/2005/9/prweb282148.htm